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Failure Modes and Mechanisms in Electronic Packages / P. Singh, Puligandla Viswanadham | |
Publisher: Springer | |
Availability:Usually ships in 24 hours | |
Sales Rank: 1395726 | |
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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.