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Low formaldehyde emission particleboard bonded by UF-MDI mixture adhesive.(Technical Note): An article from: Forest Products Journal

Author Weihong Wang, Xianquan Zang, Renshu Lu
Publisher Forest Products Society
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Book Details
ISBN / ASINB00084B7UU
ISBN-13978B00084B7U7
AvailabilityAvailable for download now
Sales Rank13,699,393
MarketplaceUnited States 🇺🇸

Description

This digital document is an article from Forest Products Journal, published by Forest Products Society on September 1, 2004. The length of the article is 3373 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Low formaldehyde emission particleboard bonded by UF-MDI mixture adhesive.(Technical Note)
Author: Weihong Wang
Publication:Forest Products Journal (Refereed)
Date: September 1, 2004
Publisher: Forest Products Society
Volume: 54 Issue: 9 Page: 36(4)

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