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Books by John H. Lau, Yi-Hsin Pao

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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch Smt Assemblies (Electronic Packaging & Interconnection Series)
🇩🇪 Germany
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine P…
By: John H. Lau, Yi-Hsin Pao
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Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies
🇺🇸 United States
Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine P…
By: John H. Lau, Yi-Hsin Pao
View Details