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Wire Bonding in Microelectronics: Materials, Processes, Reliability, and Yield

AuthorGeorge Harman
PublisherMcGraw-Hill Professional
CategoryTechnology & Engineering
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Book Details

Author(s)George Harman
PublisherMcGraw-Hill Professional
ISBN / ASIN0070326193
ISBN-139780070326194
CategoryTechnology & Engineering
MarketplaceUnited States  🇺🇸

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