Area Array Packaging Handbook: Manufacturing and Assembly
131.00
USD
Book Details
Author(s)
Ken Gilleo
Publisher
McGraw-Hill Professional
ISBN / ASIN
0071374930
ISBN-13
9780071374934
Sales Rank
#3,569,831
Marketplace
United States 🇺🇸
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Description
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
