International Symposium on Advanced Pacakaging Materials: Processes, Properties and Interfaces : Chateau Elan, Braselton, Georgia March 6-8, 2000 : Proceedings
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📖 Description
These conference proceedings cover such topics as: high density packaging materials; automotive electronics; system level packaging; chip scale packaging; optoelectronics; power packaging; sensors; actuators, and MEMS; flex circuits; and thermal management.
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