BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs

This book is for PCB designers who are designing boards with multiple very large Ball Grid Array (BGA) packages. It explores the impact of dense BGAs with high pin-count on PCB design and provides solutions for the inherent design challenges. Though you may not yet have been confronted with the difficulties of routing BGAs and the impact on fabrication costs and signal integrity, this book will reveal these potential pitfalls as well as methods to mitigate these problems.