Home › Books › Solder Joint Reliability: Theory and Applications
Solder Joint Reliability: Theory and Applications Buy on Amazon

https://www.ebooknetworking.net/books_detail-1461367433.html

Solder Joint Reliability: Theory and Applications

AuthorJohn H. Lau
PublisherSpringer
Shop on Amazon — choose your country
🇺🇸 USA 🇨🇦 Canada 🇬🇧 UK 🇩🇪 Germany 🇫🇷 France 🇮🇳 India
339.00 USD
Buy New on Amazon 🇺🇸

Book Details

Author(s)John H. Lau
PublisherSpringer
ISBN / ASIN1461367433
ISBN-139781461367437
MarketplaceUnited States  🇺🇸

More Books by John H. Lau

Ball Grid Array Technology
Ball Grid Array Technology
View
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
Low Cost Flip Chip Technologies for DCA, WLCSP, and PB…
View
Reliability of RoHS-Compliant 2D and 3D IC Interconnects (Electronic Engineering)
Reliability of RoHS-Compliant 2D and 3D IC Interconnec…
View
3D IC Integration and Packaging
3D IC Integration and Packaging
View
Handbook Of Tape Automated Bonding
Handbook Of Tape Automated Bonding
View
Handbook of Fine Pitch Surface Mount Technology (Electrical Engineering)
Handbook of Fine Pitch Surface Mount Technology (Elect…
View
Chip On Board: Technology for Multichip Modules (E; Ectrical Engineering)
Chip On Board: Technology for Multichip Modules (E; Ec…
View
Donate to EbookNetworking
Prev
Next