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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials)

Name: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials)
Author: E-H Wong, Y.-W. Mai
ISBN: 9781845695286

AuthorE-H Wong, Y.-W. Mai

PublisherWoodhead Publishing

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Book Details

Author(s)E-H Wong, Y.-W. Mai

PublisherWoodhead Publishing

ISBN / ASIN1845695283

ISBN-139781845695286

MarketplaceUnited States 🇺🇸