HIGH-PERFORMANCE POLYMERS VOLUME 1 (Publication IFP)

High performance polymers are extensively used in the fabrication, assembly and packaging of semiconductor components. The basic purpose of this book is to review the present status of the electrically conductive and thermally conductive adhesive technology, primarily for the well established die attach market, but also for the anisotropic adhesive films used to interconnect electronic drivers to liquid crystal display panels, and adhesives which are currently tested to replace soft solders in the surface mount technology. Contents: 1. Applications, market survey and standards. 2. Electrical and thermal conductivities. 3. Fillers and resins. 4. Properties of uncured adhesives. 5. Properties of cured adhesives. 6. Thermally-induced stresses. 7. Reliability concerns. 8. Current developments.