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Cooling Of Microelectronic and Nanoelectronic Equipment: Advances and Emerging Research (Wspc Series in Advanced Integration and Packaging) (Volume 3) / | |
Publisher: World Scientific Publishing Company | |
Availability:Usually ships in 24 hours | |
Sales Rank: 7248533 | |
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This book can be used by researchers and practitioners of thermal engineering to gain insight into next generation thermal packaging solutions. It is an excellent reference text for graduate-level courses in heat transfer and electronics packaging.
Readership: Researchers, practitioners, and postgraduates in mechanical engineering, nanoelectronics, computer engineering, and electrical & electronic engineering.
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