Plating high aspect ratio PCBs: achieving proper copper deposition in holes on thicker boards is no easy task, even with reverse pulse plating. ... from: Printed Circuit Design & Manufacture

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Citation Details
Title: Plating high aspect ratio PCBs: achieving proper copper deposition in holes on thicker boards is no easy task, even with reverse pulse plating. Understanding the ins and outs of electrolyte agitation is critical.(Copper Plating)
Author: Stephen Kenny
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: January 1, 2005
Publisher: UP Media Group, Inc.
Volume: 22 Issue: 1 Page: 22(6)

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