Thermal issues and properties of embedded resistors: a study of power dissipation characteristics and their effect on laminates is launched.(Getting ... from: Printed Circuit Design & Manufacture
Book Details
Author(s)
Richard Snogren
Publisher
UP Media Group, Inc.
ISBN / ASIN
B00082LIHY
ISBN-13
978B00082LIH6
Availability
Available for download now
Marketplace
United States 🇺🇸
Ratings & Reviews
No reviews yet — be the first!
No reviews yet.
Description
This digital document is an article from Printed Circuit Design & Manufacture, published by UP Media Group, Inc. on May 1, 2004. The length of the article is 777 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details
Title: Thermal issues and properties of embedded resistors: a study of power dissipation characteristics and their effect on laminates is launched.(Getting Embedded)
Author: Richard Snogren
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: May 1, 2004
Publisher: UP Media Group, Inc.
Volume: 21 Issue: 5 Page: 21(1)
Distributed by Thomson Gale
Citation Details
Title: Thermal issues and properties of embedded resistors: a study of power dissipation characteristics and their effect on laminates is launched.(Getting Embedded)
Author: Richard Snogren
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: May 1, 2004
Publisher: UP Media Group, Inc.
Volume: 21 Issue: 5 Page: 21(1)
Distributed by Thomson Gale
