Epoxy nanocomposites: analysis and kinetics of cure.: An article from: Polymer Engineering and Science
Book Details
PublisherSociety of Plastics Engineers, Inc.
ISBN / ASINB00082YYM0
ISBN-13978B00082YYM6
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Sales Rank99,999,999
MarketplaceUnited States 🇺🇸
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This digital document is an article from Polymer Engineering and Science, published by Society of Plastics Engineers, Inc. on June 1, 2004. The length of the article is 5106 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
From the author: The effect of organo-nanoclay (Nanomer I30E) on the cure mechanism and kinetics of epoxy nanocomposites based on Epon 828 and Epicure 3046 was studied by means of dynamic differential scanning calorimetry (DSC) at four heating rates (2.5, 5, 10, and 20[degrees]C*[min.sup.-1]) and by Fourier transform infrared (FT-IR) spectroscopy. The DSC cure data for epoxy-amine mixtures with and without nanoclay was modeled by means of different approaches; the Kissinger and isoconversional models were used to calculate the kinetics parameters while the Avrami model was utilized to compare the cure behavior of the two systems. The Nanomer I30E was shown to initiate rapid homopolymerization of the Epon 828 resin at temperatures above 180[degrees]C. For the epoxy-amine mixtures, the presence of nanoclay had little effect on the cure kinetics in the early stages (i.e., at lower temperatures), and the apparent activation energy was around 60 kJ*[mol.sup.-1]. However, in the later stages, the apparent activation energy increased significantly in the absence of nanoclay, but did not do so when it was present. The presence of nanoclay also lowered the final glass transition temperature by about 4[degrees]C. Polym. Eng. Sci. 44:1132-1141, 2004.
Citation Details
Title: Epoxy nanocomposites: analysis and kinetics of cure.
Author: M.-T. Ton-That
Publication:Polymer Engineering and Science (Refereed)
Date: June 1, 2004
Publisher: Society of Plastics Engineers, Inc.
Volume: 44 Issue: 6 Page: 1132(10)
Distributed by Thomson Gale
From the author: The effect of organo-nanoclay (Nanomer I30E) on the cure mechanism and kinetics of epoxy nanocomposites based on Epon 828 and Epicure 3046 was studied by means of dynamic differential scanning calorimetry (DSC) at four heating rates (2.5, 5, 10, and 20[degrees]C*[min.sup.-1]) and by Fourier transform infrared (FT-IR) spectroscopy. The DSC cure data for epoxy-amine mixtures with and without nanoclay was modeled by means of different approaches; the Kissinger and isoconversional models were used to calculate the kinetics parameters while the Avrami model was utilized to compare the cure behavior of the two systems. The Nanomer I30E was shown to initiate rapid homopolymerization of the Epon 828 resin at temperatures above 180[degrees]C. For the epoxy-amine mixtures, the presence of nanoclay had little effect on the cure kinetics in the early stages (i.e., at lower temperatures), and the apparent activation energy was around 60 kJ*[mol.sup.-1]. However, in the later stages, the apparent activation energy increased significantly in the absence of nanoclay, but did not do so when it was present. The presence of nanoclay also lowered the final glass transition temperature by about 4[degrees]C. Polym. Eng. Sci. 44:1132-1141, 2004.
Citation Details
Title: Epoxy nanocomposites: analysis and kinetics of cure.
Author: M.-T. Ton-That
Publication:Polymer Engineering and Science (Refereed)
Date: June 1, 2004
Publisher: Society of Plastics Engineers, Inc.
Volume: 44 Issue: 6 Page: 1132(10)
Distributed by Thomson Gale
