Thermal analysis of base materials through assembly: can current analytical techniques predict and characterize differences in laminate performance ... from: Printed Circuit Design & Manufacture

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Citation Details
Title: Thermal analysis of base materials through assembly: can current analytical techniques predict and characterize differences in laminate performance prior to exposure to thermal excursions during assembly?(Laminate Performance)
Author: Erik J. Bergum
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: September 1, 2003
Publisher: UP Media Group, Inc.
Volume: 20 Issue: 9 Page: 36(5)

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