Methodology for high aspect ratio pulse plating: periodic reverse pulse tanks were once seen as a current density capacity enhancement for "standard ... from: Printed Circuit Design & Manufacture

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Citation Details
Title: Methodology for high aspect ratio pulse plating: periodic reverse pulse tanks were once seen as a current density capacity enhancement for "standard thickness" boards. Now they churn out PCBs with aspect ratios of 15:1.(Pulse Plating)
Author: Robert D. Edwards
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: January 1, 2004
Publisher: UP Media Group, Inc.
Volume: 21 Issue: 1 Page: 32(5)

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