Optimizing stencil design for Pb-free SMT: in quantifying the impact of solder spread on typical SMT defects, the authors devised new apertures and a ... Story): An article from: Circuits Assembly

This digital document is an article from Circuits Assembly, published by UP Media Group, Inc. on July 1, 2005. The length of the article is 3054 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Optimizing stencil design for Pb-free SMT: in quantifying the impact of solder spread on typical SMT defects, the authors devised new apertures and a new test pattern.(Cover Story)
Author: Ranjit S. Pandher
Publication:Circuits Assembly (Magazine/Journal)
Date: July 1, 2005
Publisher: UP Media Group, Inc.
Volume: 16 Issue: 7 Page: 32(5)

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