Reflecting on mirrored IC pinouts: flipping the die within a package can shrink real estate and the number of vias and layers. But the chip makers ... from: Printed Circuit Design & Manufacture

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Citation Details
Title: Reflecting on mirrored IC pinouts: flipping the die within a package can shrink real estate and the number of vias and layers. But the chip makers will have to get on board first.(PACKAGING)
Author: Charles Clark
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: September 1, 2005
Publisher: Thomson Gale
Volume: 22 Issue: 9 Page: 26(4)

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