Effects of plane splits on high-speed signals, Part 2: signal and power integrity degradation can occur in PCBs and IC packages due to high-speed ... from: Printed Circuit Design & Manufacture Buy on Amazon
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Effects of plane splits on high-speed signals, Part 2: signal and power integrity degradation can occur in PCBs and IC packages due to high-speed ... from: Printed Circuit Design & Manufacture

Author Abe Riazi
Publisher Thomson Gale
9.95 USD

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Book Details
Author(s) Abe Riazi
Publisher Thomson Gale
ISBN / ASIN B000PM8A6O
ISBN-13 978B000PM8A60
Availability Available for download now
Marketplace United States 🇺🇸
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Description
This digital document is an article from Printed Circuit Design & Manufacture, published by Thomson Gale on April 1, 2007. The length of the article is 1252 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.

Citation Details
Title: Effects of plane splits on high-speed signals, Part 2: signal and power integrity degradation can occur in PCBs and IC packages due to high-speed traces traversing plane-splits.(INTERCONNECT STRATEGIES)
Author: Abe Riazi
Publication:Printed Circuit Design & Manufacture (Magazine/Journal)
Date: April 1, 2007
Publisher: Thomson Gale
Volume: 24 Issue: 4 Page: 18(3)

Distributed by Thomson Gale
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