Effects of plane splits on high-speed signals, Part 2: signal and power integrity degradation can occur in PCBs and IC packages due to high-speed ... from: Printed Circuit Design & Manufacture
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This digital document is an article from Printed Circuit Design & Manufacture, published by Thomson Gale on April 1, 2007. The length of the article is 1252 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available in your Amazon.com Digital Locker immediately after purchase. You can view it with any web browser.
Citation Details Title: Effects of plane splits on high-speed signals, Part 2: signal and power integrity degradation can occur in PCBs and IC packages due to high-speed traces traversing plane-splits.(INTERCONNECT STRATEGIES) Author: Abe Riazi Publication:Printed Circuit Design & Manufacture (Magazine/Journal) Date: April 1, 2007 Publisher: Thomson Gale Volume: 24 Issue: 4 Page: 18(3)