PCB dielectric degradation in lead-free assembly applications: reliable lead-free assemblies require a collaborative approach that optimizes the PCB ... An article from: Printed Circuit Design & Fab

This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on May 1, 2008. The length of the article is 3144 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.

Citation Details
Title: PCB dielectric degradation in lead-free assembly applications: reliable lead-free assemblies require a collaborative approach that optimizes the PCB design along with specific base materials and known fabrication processes.(LEAD-FREE RELIABILITY)
Author: Paul Reid
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: May 1, 2008
Publisher: UP Media Group, Inc.
Volume: 25 Issue: 5 Page: 32(5)

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