Thermoelectric applications for imaging infrared focal plane arrays.: An article from: Journal of the South Carolina Academy of Science
Book Details
Author(s)Roy T. Littleton
PublisherSouth Carolina Academy of Science
ISBN / ASINB002AWX0JY
ISBN-13978B002AWX0J0
AvailabilityAvailable for download now
Sales Rank14,063,575
MarketplaceUnited States 🇺🇸
Description
This digital document is an article from Journal of the South Carolina Academy of Science, published by South Carolina Academy of Science on September 22, 2008. The length of the article is 1455 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
From the author: The development of thermoelectric (TE) materials and device structures is essential to the performance of many commercial and military electronic systems. Tactical infrared (IR) imaging sensors, for example, typically require some form of cooling to optimize performance and range without compromising on size, weight and power. The dark current for these imaging sensors increases with wavelength thus adding to the cooling requirement. Novel approaches are being developed to integrate low dimensional materials that exhibit enhanced TE properties with IR focal plane array (FPA) manufacturing processes. These types of approaches could significantly increase the potential of future fielded soldier imaging systems.
Citation Details
Title: Thermoelectric applications for imaging infrared focal plane arrays.
Author: Roy T. Littleton
Publication:Journal of the South Carolina Academy of Science (Magazine/Journal)
Date: September 22, 2008
Publisher: South Carolina Academy of Science
Volume: 6 Issue: 2 Page: 24(3)
Distributed by Gale, a part of Cengage Learning
From the author: The development of thermoelectric (TE) materials and device structures is essential to the performance of many commercial and military electronic systems. Tactical infrared (IR) imaging sensors, for example, typically require some form of cooling to optimize performance and range without compromising on size, weight and power. The dark current for these imaging sensors increases with wavelength thus adding to the cooling requirement. Novel approaches are being developed to integrate low dimensional materials that exhibit enhanced TE properties with IR focal plane array (FPA) manufacturing processes. These types of approaches could significantly increase the potential of future fielded soldier imaging systems.
Citation Details
Title: Thermoelectric applications for imaging infrared focal plane arrays.
Author: Roy T. Littleton
Publication:Journal of the South Carolina Academy of Science (Magazine/Journal)
Date: September 22, 2008
Publisher: South Carolina Academy of Science
Volume: 6 Issue: 2 Page: 24(3)
Distributed by Gale, a part of Cengage Learning
