PCB stackup analysis and design, Part 5: PCB stackup influences board impedance, signal integrity and the EMI performance of the system.(INTERCONNECT ... An article from: Printed Circuit Design & Fab
Book Details
Author(s)Abe "Abbas" Riazi
PublisherUP Media Group, Inc.
ISBN / ASINB002DP07W6
ISBN-13978B002DP07W3
AvailabilityAvailable for download now
MarketplaceUnited States 🇺🇸
Description
This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on June 1, 2009. The length of the article is 1184 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: PCB stackup analysis and design, Part 5: PCB stackup influences board impedance, signal integrity and the EMI performance of the system.(INTERCONNECT STRATEGIES)
Author: Abe "Abbas" Riazi
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: June 1, 2009
Publisher: UP Media Group, Inc.
Volume: 26 Issue: 6 Page: 14(2)
Distributed by Gale, a part of Cengage Learning
Citation Details
Title: PCB stackup analysis and design, Part 5: PCB stackup influences board impedance, signal integrity and the EMI performance of the system.(INTERCONNECT STRATEGIES)
Author: Abe "Abbas" Riazi
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: June 1, 2009
Publisher: UP Media Group, Inc.
Volume: 26 Issue: 6 Page: 14(2)
Distributed by Gale, a part of Cengage Learning
