![Bridging technology between 3D conventional stacking and TSV 3D stacking: a new wirebond PoP achieves nearly 1000 interconnects at 200[micro]m ... An article from: Printed Circuit Design & Fab](https://www.ebooknetworking.net/books/noimage.jpg)
Bridging technology between 3D conventional stacking and TSV 3D stacking: a new wirebond PoP achieves nearly 1000 interconnects at 200[micro]m ... An article from: Printed Circuit Design & Fab
Book Details
Author(s)Belgacem Haba
PublisherUP Media Group, Inc.
ISBN / ASINB00D03Y2HQ
ISBN-13978B00D03Y2H7
AvailabilityAvailable for download now
MarketplaceUnited States 🇺🇸
Description
This digital document is an article from Printed Circuit Design & Fab, published by UP Media Group, Inc. on March 1, 2013. The length of the article is 2303 words. The page length shown above is based on a typical 300-word page. The article is delivered in HTML format and is available immediately after purchase. You can view it with any web browser.
Citation Details
Title: Bridging technology between 3D conventional stacking and TSV 3D stacking: a new wirebond PoP achieves nearly 1000 interconnects at 200[micro]m pitch.(COVER STORY)
Author: Belgacem Haba
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: March 1, 2013
Publisher: UP Media Group, Inc.
Volume: 30 Issue: 3 Page: 33(5)
Distributed by Gale, a part of Cengage Learning
Citation Details
Title: Bridging technology between 3D conventional stacking and TSV 3D stacking: a new wirebond PoP achieves nearly 1000 interconnects at 200[micro]m pitch.(COVER STORY)
Author: Belgacem Haba
Publication:Printed Circuit Design & Fab (Magazine/Journal)
Date: March 1, 2013
Publisher: UP Media Group, Inc.
Volume: 30 Issue: 3 Page: 33(5)
Distributed by Gale, a part of Cengage Learning
