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Connecting flex layers using conductive paste: a novel process eliminates copper plating, potentially increasing board flexibility and ... An article from: Printed Circuit Design & Fab Buy on Amazon

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Connecting flex layers using conductive paste: a novel process eliminates copper plating, potentially increasing board flexibility and ... An article from: Printed Circuit Design & Fab

AuthorMike Buetow
PublisherUP Media Group, Inc.
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Book Details

Author(s)Mike Buetow
PublisherUP Media Group, Inc.
ISBN / ASINB00GJD4X7I
ISBN-13978B00GJD4X79
AvailabilityAvailable for download now
Sales Rank99,999,999
MarketplaceUnited States  🇺🇸

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