{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies","author_name":"John H. Lau, Yi-Hsin Pao","thumbnail_url":"https://www.ebooknetworking.net/books/007/036/big0070366489.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0070366489.html\">Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies</a>","width":400,"height":300}