{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Chip Scale Package: Design, Materials, Process, Reliability, and Applications","author_name":"John H. Lau, Ricky S.W. Lee, S.W. Ricky Lee","thumbnail_url":"https://www.ebooknetworking.net/books/007/038/big0070383049.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0070383049.html\">Chip Scale Package: Design, Materials, Process, Reliability, and Applications</a>","width":400,"height":300}