{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies","author_name":"John H. Lau","thumbnail_url":"https://www.ebooknetworking.net/books/007/135/big0071351418.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0071351418.html\">Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies</a>","width":400,"height":300}