{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Advanced MEMS Packaging","author_name":"John Lau, Cheng Lee , C. Premachandran, Yu Aibin","thumbnail_url":"https://www.ebooknetworking.net/books/007/162/big0071626239.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0071626239.html\">Advanced MEMS Packaging</a>","width":400,"height":300}