{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Through-Silicon Vias for 3D Integration","author_name":"John Lau","thumbnail_url":"https://www.ebooknetworking.net/books/007/178/big0071785140.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0071785140.html\">Through-Silicon Vias for 3D Integration</a>","width":400,"height":300}