{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"3D IC Integration and Packaging","author_name":"John H. Lau","thumbnail_url":"https://www.ebooknetworking.net/books/007/184/big0071848061.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0071848061.html\">3D IC Integration and Packaging</a>","width":400,"height":300}