{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Solder Joint Reliability Prediction for Multiple Environments","author_name":"Andrew E. Perkins, Suresh K. Sitaraman","thumbnail_url":"https://www.ebooknetworking.net/books/038/779/big0387793933.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0387793933.html\">Solder Joint Reliability Prediction for Multiple Environments</a>","width":400,"height":300}