{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)","author_name":"R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein","thumbnail_url":"https://www.ebooknetworking.net/books/041/208/big0412084619.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0412084619.html\">Microelectronics Packaging Handbook, 3-part set: Part I: Technology Drivers Part II: Semiconductor Packaging Part III: Subsystem Packaging (Part 3)</a>","width":400,"height":300}