{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability","author_name":"Michael Pecht","thumbnail_url":"https://www.ebooknetworking.net/books/047/159/big0471594466.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-0471594466.html\">Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability</a>","width":400,"height":300}