{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Materials, Integration and Packaging Issues for High-Frequency Devices: Volume 783 (MRS Proceedings)","author_name":"Muralt, P.","thumbnail_url":"https://www.ebooknetworking.net/books/110/740/big1107409365.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1107409365.html\">Materials, Integration and Packaging Issues for High-Frequency Devices: Volume 783 (MRS Proceedings)</a>","width":400,"height":300}