{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Low temperature wafer level vaccum packaging using gold-silicon eutectic bonding and localized heating.","author_name":"Jay S Mitchell","thumbnail_url":"https://www.ebooknetworking.net/books/124/343/big1243431849.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1243431849.html\">Low temperature wafer level vaccum packaging using gold-silicon eutectic bonding and localized heating.</a>","width":400,"height":300}