{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Packaging (microfabrication), including: Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, ... Encapsulation, Integrated Circuit Packaging","author_name":"Hephaestus Books","thumbnail_url":"https://www.ebooknetworking.net/books/124/488/big1244884669.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1244884669.html\">Packaging (microfabrication), including: Dual In-line Package, Ball Grid Array, Surface-mount Technology, Pin Grid Array, Zig-zag In-line Package, ... Encapsulation, Integrated Circuit Packaging</a>","width":400,"height":300}