{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (The Springer International Series in Engineering and Computer Science)","author_name":"Erdogan Madenci, Ibrahim Guven, Bahattin Kilic","thumbnail_url":"https://www.ebooknetworking.net/books/140/207/big1402073305.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1402073305.html\">Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys® (The Springer International Series in Engineering and Computer Science)</a>","width":400,"height":300}