{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Semiconductor Packaging: Materials Interaction and Reliability","author_name":"Andrea Chen, Randy Hsiao-Yu Lo","thumbnail_url":"https://www.ebooknetworking.net/books/143/986/big1439862052.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1439862052.html\">Semiconductor Packaging: Materials Interaction and Reliability</a>","width":400,"height":300}