{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics)","author_name":"Xingcun Colin Tong","thumbnail_url":"https://www.ebooknetworking.net/books/144/197/big1441977589.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1441977589.html\">Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics)</a>","width":400,"height":300}