{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages","author_name":"Gerard Kelly","thumbnail_url":"https://www.ebooknetworking.net/books/146/137/big1461372763.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1461372763.html\">The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages</a>","width":400,"height":300}