{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications","author_name":"Shichun Qu, Yong Liu","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1493954385.html\">Wafer-Level Chip-Scale Packaging: Analog and Power Semiconductor Applications</a>","width":400,"height":300}