{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies","author_name":"Chapman II, Gilbert B.","thumbnail_url":"https://www.ebooknetworking.net/books/149/692/big149692553X.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-149692553X.html\">Nondestructive Evaluation of Adhesive Bonds Using 20 MHz and 25 Khz Ultrasonic Frequencies on Metal and Polymer Assemblies</a>","width":400,"height":300}