{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials)","author_name":"E-H Wong, Y.-W. Mai","thumbnail_url":"https://www.ebooknetworking.net/books/184/569/big1845695283.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-1845695283.html\">Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture (Woodhead Publishing Series in Electronic and Optical Materials)</a>","width":400,"height":300}