{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Technology of III-V, II-VI, and Non-Tetrahedrally Bonded Compounds / Technologie der III-VI, II-VI und nicht-tetraedrisch gebundenen Verbindungen ... - New Series / Condensed Matter) (Vol 17)","author_name":"J. Baars, P. Glasgow, R. Helbig, H. Jacob, K. Kassel, H. Maier, G. Müller, H. Runge, M. Schulz, E. Tomzig, C. Weyrich","thumbnail_url":"https://www.ebooknetworking.net/books/noimage.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-3540117792.html\">Technology of III-V, II-VI, and Non-Tetrahedrally Bonded Compounds / Technologie der III-VI, II-VI und nicht-tetraedrisch gebundenen Verbindungen ... - New Series / Condensed Matter) (Vol 17)</a>","width":400,"height":300}