{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Integrated Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication: From Particle Scale to Feature, Die And Wafer Scales","author_name":"Jianfeng Luo, David Dornfeld","thumbnail_url":"https://www.ebooknetworking.net/books/354/022/big354022369X.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-354022369X.html\">Integrated Modeling Of Chemical Mechanical Planarization For Sub-Micron IC Fabrication: From Particle Scale to Feature, Die And Wafer Scales</a>","width":400,"height":300}