{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"High Frequency Interconnect Characterization and Modeling: For VLSI On-Chip Interconnects and RF Package Wire Bonds","author_name":"Xiaoning Qi","thumbnail_url":"https://www.ebooknetworking.net/books/363/913/big3639130952.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-3639130952.html\">High Frequency Interconnect Characterization and Modeling: For VLSI On-Chip Interconnects and RF Package Wire Bonds</a>","width":400,"height":300}