{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Rheology and processing of pastes for electronic packaging materials: Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives","author_name":"Rajkumar Durairaj","thumbnail_url":"https://www.ebooknetworking.net/books/363/915/big363915746X.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-363915746X.html\">Rheology and processing of pastes for electronic packaging materials: Novel rheological characterisation techniques for lead-free solder pastes and electrical conductive adhesives</a>","width":400,"height":300}