{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (Springer Theses)","author_name":"Qingke Zhang","thumbnail_url":"https://www.ebooknetworking.net/books/366/248/big3662488213.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-3662488213.html\">Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces (Springer Theses)</a>","width":400,"height":300}