{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Development of Advanced Endpoint Detection and Process Control for Chemical Mechanical Polishing (CMP) in VLSI Circuit Fabrication (Berichte Aus Der Halbleitertechnik)","author_name":"Gotz Springer","thumbnail_url":"https://www.ebooknetworking.net/books/382/657/big3826578058.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-3826578058.html\">Development of Advanced Endpoint Detection and Process Control for Chemical Mechanical Polishing (CMP) in VLSI Circuit Fabrication (Berichte Aus Der Halbleitertechnik)</a>","width":400,"height":300}