{"version":"1.0","type":"rich","provider_name":"EbookNetworking","provider_url":"https://www.ebooknetworking.net","title":"Interfacial Energy for Oraganosilane tailored Copper-Silica Interface: Delamination Nanomechanics and Energy Partition into Adhesion and Plasticity","author_name":"Ashutosh Jain","thumbnail_url":"https://www.ebooknetworking.net/books/384/337/big3843373906.jpg","thumbnail_width":330,"thumbnail_height":500,"html":"<a href=\"https://www.ebooknetworking.net/books_detail-3843373906.html\">Interfacial Energy for Oraganosilane tailored Copper-Silica Interface: Delamination Nanomechanics and Energy Partition into Adhesion and Plasticity</a>","width":400,"height":300}